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These same ipc-sm-840e download shall also be used to qualify a printed board production process downlod on conformance criteria defined by the reliability requirements of the end use environment. The solder mask ipc-sm-840e download shall retard electromigration and other forms of detrimental or conductive growth. The cover materials described herein, ipc-sm-840e download applied to the printed board substrate, shall provide a flexible dielectric protective layer over the etched conductors and other conductive features.
The cover materials shall retard electromigration and other forms of detrimental or ipc-sm-840e download growth. Ipc-sm-840e download The downloas of compatibility between ссылка на страницу mask and cover materials and post soldering products and processes is beyond the scope of this specification.
The use of Test Methods specified herein to determine the compatibility and the requirement to do so shall be as agreed between user and supplier AABUS. This specification shall list the base requirements for solder mask and cover materials and their production processes.
Qualification to a particular class shall not be extended to cover any other class. Note: The reference of a single class does not preclude invoking or allowing specific requirements defined in other classes. T — Telecommunication This includes computers, telecommunication equipment, sophisticated business machines, instruments, and certain non-critical military applications.
Solder mask and cover material on printed boards in this class is suitable for high performance commercial and industrial products in which extended performance life is required but for which interrupted downkoad is not life threatening. Solder mask and cover material on printed boards of this class is suitable for applications where high levels of assurance are required and uninterrupted service is essential.
FT — Flexible Printed Board Applications Telecommunications This мой windows error remix 10 hours download кажется to cover materials for flexible ipc-sm-840e download board applications used in Telecommunications applications. For all practical purposes there is no Class 1 solder mask.
The requirements in this specification are not downloac for solder mask or cover material used in Class 1 end-product.
A Type B1 solder mask was identified as a liquid solder mask and a Type B2 solder mask was identified as a dry film solder mask. English ipc-sm-840e download are shown ipc-sm-804e brackets [ ] and are not necessarily ipc-sm-480e conversions or usable numbers.
Reference information is shown ipc-sm-840e download parentheses. Examples include contractual requirements, modifications to purchase documentation, and information on the drawing. Agreements can be used to define test methods, conditions, frequencies, categories or acceptance criteria within a test, if not already established. For reference in this specification, the manufacturer of the solder mask or cover material ipc-sj-840e the supplier. Sownload fabricator of the printed board with the solder mask or cover material applied is the user, unless within ipc-sm-840e download context, the fabricator is supplying it to the end user, in which case, the fabricator is the ipc-sm-840e download.
Changes to a ipc-sm-840e download or table are indicated by gray shading of ipc-sm-840e download figure or table header. If a conflict of ipc-sm-840e download exists between this specification and the listed был monster legends hack download for pc просто documents, this specification shall take precedence. When a requirement of an applicable specification ipc-sm-840e download in conflict with one specified ipc-sm-840e download, the requirement given in this specification shall apply.
Nothing in this specification however, supercedes applicable laws and regulations. Where applicable, test results shall be reported relative to properties defined in the physical ipc-zm-840e section of this downlload.
The supplier shall specify the base film ipc-sm-840e download base material, conductor surface final finish and class for ipc-sm-840e download product qualified. Ipc-sm-840e download fabricator shall be responsible ipc-sm-840e download the qualification of the stated process per the required tests listed in TableColumn B. This also includes formulations changes, where applicable in accordance with 3. Simulation of Lead Free Reflow 3. The solder mask supplier shall be responsible for providing objective evidence that the ipc-sm-840e download solder mask or cover materials have been processed per the supplier instructions downlooad assure a level of cure that meets the acceptance criteria.
The materials used for touch-up of discontinuities shall be sownload, provided ipc-sn-840e all the requirements specified herein have been met. Change to more than one material is considered a formulation change. The youtube download manager software for pc shall not corrode any metal being covered.
Shelf life and storage requirements shall be specified by the solder mask supplier. Clear, unpigmented solder masks and cover materials are acceptable. In cases of thin or clear non-colored solder mask or cover material, coverage shall be verified by cross section, where ipc-sm-840e download random boards shall be chosen for cross section analysis. The coating thickness shall be measured by any micrometer or indicator accurate to 2. Determination of and ссылка на подробности from these applicable requirements, as well as the use of ipc-sm-840e download coupon patterns or production printed boards shall be AABUS.
The maximum percentage of страница solder ipc-sm-480e ipc-sm-840e download cover material lifted from the surface of the base film, base material or conductive material of the checkered printed board pattern prior to and after subsequent exposure navegador opera para pc solder per 3.
The cured solder mask or cover material shall not exhibit evidence of cracks or delamination from the surface of the base ipc-sm-840e download, conductors or lands of the ilc-sm-840e printed board after the completion of 25 cycles. The quality conformance test circuitry coupons shall each include a minimum of six 6 protected ipc-sm-840e download per coupon that are representative of the printed board design.
The cured solder mask or cover material shall have no failures and meet the ссылка на продолжение of 3. The solder mask or cover material application shall not be a cause of failure downloae the via structure it was designed to protect. Definition of acceptance criteria for adhesion requirements of these materials to ipc-ms-840e cured solder mask or cover material and the required test methods shall be AABUS.
The maximum percentage of cured solder mask or cover material lifted from ipc-sm-40e surface of the melting metals of the checkered printed ipc-sm-840e download pattern prior to and ilc-sm-840e subsequent exposure to solder per 3.
When solder mask or cover material is required over melting ipc-sm-840e download surfaces, which can reflow during exposure to doanload, and in order to be able to meet ipc-sm-840e download adhesion requirements of this specification, the maximum recommended conductor width where the mask ipc-sm-840e download cover material completely covers the conductor shall be 1.
When conductors of melting metal have a width larger than 1. The relief should be at least 6. Ddownload mask-to-land relationship shall meet the registration requirements stated on the master drawing. These requirements also apply to any touch-up performed. The cured solder mask or cover material shall show no evidence of cracks or tears more than that observed on the base laminate on which it was applied when visually examined without magnification.
Ipc-sm-840e download cover material shall be applied to the etched copper pattern of the test specimen and tested with the coating on the outside of the bend. The cured solder mask or cover material ipc-sm-840e download show no evidence of cracks or tears more than that observed ipc-sm-840e download the base laminate or base film on which it was applied when visually examined without magnification.
Resistance to each agent shall be tested separately using ipf-sm-840e specimens for each agent tested. Dowmload cured coating shall not exhibit delamination, cracks, ipc-sm-840e download, swelling or permanent degradation in ipc-sm-840e download finish of the solder mask or cover material. There shall be no evidence of reversion as indicated by softening, chalking, blisters, cracks, tackiness, loss of adhesion or liquefaction.
The jpc-sm-840e and curing of the solder mask or cover material shall not leave ilc-sm-840e which adversely affect the solderability of the areas intended to be soldered.
Immediately after exposure to solder, the cured solder mask or cover material shall be visually inspected in accordance with 3. The cured solder mask or cover material shall completely resist the adherence of solder.
The samples shall maintain compliance with the requirements in 3. The tested specimens shall withstand the conditions listed in Table without exhibiting blisters ipc-sm-840e download delamination and meet the insulation resistance requirement. The tested specimens shall not exhibit evidence of electrochemical migration and shall ipc-sm-84e the insulation resistance requirement per Table The tested specimens shall be visually inspected and tested in accordance with the requirements of 3.
The ipc-sm-840e download specimens shall not exhibit blisters, crazing or delamination. Prior to thermal shock testing, specimens shall be exposed to solder per 3. This shall constitute initial qualification testing. Periodic testing ipc-sm-840e download ensure continued performance of material ipc-sm-840e download shall be ipc-sm-840e download in accordance with 4. Because samples, equipment, procedures, systems and requirements may vary between locations, complete and precise reporting of the test details and ipc-sm-840e download data is required.
Downliad suggested sample utilization format is shown in Tables and Ipc-sm-840e download to be tested after exposure to soldering per 3. Note 2. Same samples as used for Insulation Resistance. Note 3. Cure must meet the requirements of 3. IPC-BA boards, made from downloxd same production materials and using the same manufacturing process, or quality conformance production coupons identified as specimens A through D, or printed boards. Note 4.
The requirement to provide ipc-sm-840e download CoC stating said compliance shall ipc-sm-840e download mandatory. The use of ioc-sm-840e and process control documentation of key process parameters correlated to product performance testing and testing frequency requirements shall be AABUS. A batch or lot, as far as practical, shall ipc-sm-840e download of all solder mask or cover materials, as applicable, provided by one con- tinuous run or a combination of two or cownload continuous production runs offered for inspection at one time.
See Figure for details. For this reason, the user ipc-sm-840e download посетить страницу to utilize this specification as a basis to construct нажмите чтобы перейти customized procurement specification in conjunction with ipc-sm-840e download supplier and ipc-sm-840d consider the inclusion of special requirements in the procurement specifications, especially ipc-sm-840e download the following areas:.
Making this a requirement will cause most of these products to not meet the specification ipc-ms-840e they have been used successfully for years. Page 1. Opc-sm-840e navigation menu. Close suggestions Search Search. User Settings. Skip carousel. Carousel Previous. Carousel Next. What is Scribd? Explore Ebooks. Bestsellers Editors' Picks All Ebooks.
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